ledtech

LED low-temperature lighting manufacturer Hwa Hsing Electronics (Stock Code: 6164) has unveiled a new CSP high bay and floodlight source module. Utilizing in-house developed packaging technology, the new module achieves up to 600W power output within a compact 75mm x 75mm area, specifically designed for high bay and floodlight applications.

Hwa Hsing Electronics continues to focus on the development of a full range of products including indoor and outdoor LED luminaires, LED packaging, LED strips, and LED light engines, showcasing its strength in vertically integrated product solutions.

💡 What is CSP Technology?

CSP (Chip Scale Package) technology is defined as an LED package whose dimensions are equal to or no more than 1.2 times the size of the LED chip itself, while still retaining full LED functionality. The goal of CSP is to minimize package size as much as possible without sacrificing luminous efficacy.

With the significant reduction in component size, CSP offers major advantages such as:

Lower cost

Smaller light-emitting surface

Longer component lifespan

Furthermore, the compact form factor provides greater flexibility for secondary optical optimization, allowing for lower optical processing costs. As a result, lighting products incorporating CSP can achieve maximum brightness and beam angle within a highly compact optical structure, offering outstanding design flexibility and potential to become a mainstream LED packaging solution.